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PACKAGE DIMENSIONS

.236

.157

.150

PIN 1 ID

5

D

4

.061

.055

18X

1

20

.025

B

4

B

B

4

A

.0125

.344

.337

5

C

L

10

11

.118

2X 10 TIPS

2X

3

.003 H

A-B D

H

C

20X

SEATING

PLANE

.010 C

A-B D

.004 C

7

A

NOTES:

1. DIMENSIONS ARE IN INCHES.

2. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

3. DATUM PLANE H LOCATED AT MOLD PARTING

LINE AND COINCIDENT WITH LEAD, WHERE

LEAD EXITS PLASTIC BODY AT BOTTOM OF

PARTING LINE.

4. DATUM A, B AND D TO BE DETRMINED WHERE

CENTERLINE BETWEEN LEADS EXITS PLASTIC

BODY AT DATUM PLANE H.

5. THIS DIMENSION DOES NOT INCLUDE MOLD

FLASH OR PROTRUSIONS, BUT DO INCLUDE

MOLD MISMATCH AND ARE MEASURED AT THE

MOLD PARTING LINE. MOLD FLASH OR

PROTRUSIONS SHALL NOT EXCEED .006

INCHES FOR ENDS AND .008 INCHES FOR

SIDES.

6. THIS DIMENSION IS LENGTH OF TERMINAL FOR

SOLDERING A SUBSTRATE.

7. FORMED LEADS SHALL BE PLANAR WITH

RESPECT TO ONE ANOTHER WITHIN .004

INCHES AT SEATING PLANE.

8. THIS DIMENSION IS DEFINED AS THE DISTANCE

FROM THE SEATING PLANE TO THE LOWEST

POINT OF THE PACKAGE BODY.

A

0藲

(.010)

.010

.007

.012

.008

.007

M

MIN

BASE METAL

R.003 MIN

(.008)

.010

GAUGE PLANE

PLATING

.0098

.0040

8

C A-B D

8藲

0藲

.035

.016

6

SECTION A-A

SECTION B-B

CASE 1461-02

ISSUE O

20 SSOP PACKAGE

MPC9817

Advanced Clock Drivers Devices

Freescale Semiconductor

7

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