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ISL5761

Small Outline Plastic Packages (SOIC)

N

INDEX

AREA

E

-B-

1

2

3

SEATING PLANE

-A-

D

-C-

A

h x 45

o

H

0.25(0.010) M

B M

M28.3

(JEDEC MS-013-AE ISSUE C)

28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE

INCHES

SYMBOL

A

A1

L

MILLIMETERS

MIN

2.35

0.10

0.33

0.23

17.70

7.40

MAX

2.65

0.30

0.51

0.32

18.10

7.60

NOTES

-

-

9

-

3

4

-

-

5

6

7

8

o

-

Rev. 0 12/93

MIN

0.0926

0.0040

0.013

0.0091

0.6969

0.2914

MAX

0.1043

0.0118

0.0200

0.0125

0.7125

0.2992

B

C

D

E

偽

碌

A1

0.10(0.004)

C

e

H

h

L

N

0.05 BSC

0.394

0.01

0.016

28

0

o

8

o

0.419

0.029

0.050

1.27 BSC

10.00

0.25

0.40

28

0

o

10.65

0.75

1.27

e

B

0.25(0.010) M

C A M

B S

NOTES:

1. Symbols are defined in the 鈥淢O Series Symbol List鈥?in Section 2.2

of Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension 鈥淒鈥?does not include mold flash, protrusions or gate

burrs. Mold flash, protrusion and gate burrs shall not exceed

0.15mm (0.006 inch) per side.

4. Dimension 鈥淓鈥?does not include interlead flash or protrusions. In-

terlead flash and protrusions shall not exceed 0.25mm (0.010

inch) per side.

5. The chamfer on the body is optional. If it is not present, a visual

index feature must be located within the crosshatched area.

6. 鈥淟鈥?is the length of terminal for soldering to a substrate.

7. 鈥淣鈥?is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. The lead width 鈥淏鈥? as measured 0.36mm (0.014 inch) or greater

above the seating plane, shall not exceed a maximum value of

0.61mm (0.024 inch)

10. Controlling dimension: MILLIMETER. Converted inch dimen-

sions are not necessarily exact.

偽

12

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