PRODUCT SPECIFICATION
RV4140A
Mechanical Dimensions
(continued)
8-Lead SOIC Package
Inches
Min.
A
A1
B
C
D
E
e
H
h
L
N
a
ccc
.053
.004
.013
.008
.189
Max.
.069
.010
.020
.010
.197
Millimeters
Min.
1.35
0.10
0.33
0.20
4.80
Max.
1.75
0.25
0.51
0.25
5.00
5
2
2
Notes:
Notes
1. Dimensioning and tolerancing per ANSI Y14.5M-1982.
2. "D" and "E" do not include mold flash. Mold flash or
protrusions shall not exceed .010 inch (0.25mm).
3. "L" is the length of terminal for soldering to a substrate.
4. Terminal numbers are shown for reference only.
5. "C" dimension does not include solder finish thickness.
6. Symbol "N" is the maximum number of terminals.
Symbol
.150
.158
.050 BSC
.228
.010
.016
8
0隆
鈥?/div>
8隆
.004
.244
.020
.050
3.81
4.01
1.27 BSC
5.79
0.25
0.40
8
0隆
鈥?/div>
8隆
0.10
6.20
0.50
1.27
3
6
8
5
E
H
1
4
D
A1
A
SEATING
PLANE
B
鈥揅鈥?/div>
LEAD COPLANARITY
ccc C
a
h x 45隆
C
e
L
11
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