T鈩?/div>
dB
V
V
dB
General Note:
Devices are ESD protected; however, handling precautions are recommended. All limits guaranteed by testing or statistical analysis.
Note 1:
Note 2:
Note 3:
Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when
operating the device outside its recommended operating ratings.
I/O pin voltage is any external voltage to which an input or output is referenced.
The maximum allowable power dissipation is a function of the maximum junction temperature, T
J(max)
; the junction-to-ambient thermal
resistance,
胃
JA
; and the ambient temperature, T
A
. The maximum allowable power dissipation at any ambient temperature is calculated using:
P
D
= (T
J(max)
鈥?T
A
) /
胃
JA
. Exceeding the maximum allowable power dissipation will result in excessive die temperature.
Thermal resistance,
胃
JA
, applies to a part soldered on a printed-circuit board.
Human body model, 1.5k in series with 100pF.
Short circuit may cause the device to exceed maximum allowable power dissipation. See
Note 3.
Shorting V
OUT
to V+ when V+ > 10V may damage the device.
Limited by internal bias-network resistors. Power supply must be 鈥渃lean.鈥?Power supply should be bypassed as shown in typical application
circuit.
The gain error specification applies to differential, inverting, and noninverting gains.
Note 4:
Note 5:
Note 6:
Note 7:
Note 8:
Note 9:
Note 10:
Since the part is specified in a single-supply configuration, the output load (R
L
) is a Thevenin equivalent value. The actual load consists of 2
脳
R
L
to ground and 2
脳
R
L
to the supply (V+).
December 1998
5
MIC7201