Freescale Semiconductor, Inc.
MC100ES6226
TABLE 5: GENERAL SPECIFICATIONS
Symbol
VTT
MM
HBM
CDM
LU
CIN
胃
JA
Thermal resistance junction to ambient
JESD 51-3, single layer test board
Characteristics
Output termination voltage
ESD Protection (Machine model)
ESD Protection (Human body model)
ESD Protection (Charged device model)
Latch-up immunity
200
2000
1000
200
4.0
83.1
73.3
68.9
63.8
57.4
59.0
54.4
52.5
50.4
47.8
23.0
86.0
75.4
70.9
65.3
59.6
60.6
55.7
53.8
51.5
48.8
26.3
Min
Typ
VCC - 2a
Max
Unit
V
V
V
V
mA
pF
擄C/W
擄C/W
擄C/W
擄C/W
擄C/W
擄C/W
擄C/W
擄C/W
擄C/W
擄C/W
擄C/W
Inputs
Natural convection
100 ft/min
200 ft/min
400 ft/min
800 ft/min
Natural convection
100 ft/min
200 ft/min
400 ft/min
800 ft/min
MIL-SPEC 883E
Method 1012.1
Condition
Freescale Semiconductor, Inc...
JESD 51-6, 2S2P multilayer test board
胃
JC
Thermal resistance junction to case
Operating junction temperatureb
(continuous operation)
MTBF = 9.1 years
0
110
擄C
a.
b.
Output termination voltage VTT = 0V for VCC = 2.5V operation is supported but the power consumption of the device will increase.
Operating junction temperature impacts device life time. Maximum continuous operating junction temperature should be selected according
to the application life time requirements (See application note AN1545 for more information). The device AC and DC parameters are
specified up to 110擄C junction temperature allowing the MC100ES6226 to be used in applications requiring industrial temperature range. It
is recommended that users of the MC100ES6226 employ thermal modeling analysis to assist in applying the junction temperature
specifications to their particular application.
MOTOROLA
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4
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TIMING SOLUTIONS