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ADIS16003 Datasheet

  • ADIS16003

  • Dual-Axis ±1.7 g Accelerometer with SPI Interface

  • 17頁(yè)

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ADIS16003
APPLICATIONS
DUAL-AXIS TILT SENSOR
One of the most popular applications of the ADIS16003 is tilt
measurement. An accelerometer uses the force of gravity as an
input vector to determine the orientation of an object in space.
An accelerometer is most sensitive to tilt when its sensitive axis
is perpendicular to the force of gravity, that is, parallel to the
earth鈥檚 surface. At this orientation, its sensitivity to changes in
tilt is highest. When the accelerometer is oriented on axis to
gravity, near its +1
g
or 鈥?
g
reading, the change in output
acceleration per degree of tilt is negligible. When the acceler-
ometer is perpendicular to gravity, its output changes nearly
17.5 mg per degree of tilt. At 45擄, its output changes at only
12.2 mg per degree, and resolution declines.
T
P
RAMP-UP
t
P
CRITICAL ZONE
T
L
TO T
P
TEMPERATURE
T
L
T
SMAX
T
SMIN
t
L
t
S
PREHEAT
RAMP-DOWN
05463-022
t
25擄C TO PEAK
TIME
Figure 24. Acceptable Solder Reflow Profiles
Converting Acceleration to Tilt
When the accelerometer is oriented so both its x-axis and y-axis
are parallel to the earth鈥檚 surface, it can be used as a 2-axis tilt
sensor with a roll axis and a pitch axis. Once the output signal
from the accelerometer has been converted to an acceleration
that varies between 鈥?
g
and +1
g,
the output tilt in degrees is
calculated as follows:
PITCH
=
Asin(A
X
/1
g)
ROLL
=
Asin(A
Y
/1
g)
Be sure to account for overranges. It is possible for the
accelerometers to output a signal greater than 鹵1
g
due to
vibration, shock, or other accelerations.
Table 11.
Profile Feature
Average Ramp Rate (T
L
to T
P
)
Preheat
Minimum Temperature (T
SMIN
)
Maximum Temperature (T
SMAX
)
Time (T
SMIN to
T
SMAX
) (t
s
)
T
SMAX
to T
L
Ramp-Up Rate
Time Maintained Above
Liquidous (T
L
)
Liquidous Temperature (T
L
)
Time (t
L
)
Peak Temperature (T
P
)
Time Within 5擄C of Actual Peak
Temperature (t
p
)
Ramp-Down Rate
Time 25擄C to Peak Temperature
Condition
Sn63/Pb37
Pb-free
3擄C/sec max
3擄C/sec max
100擄C
150擄C
60 sec to
120 sec
3擄C/sec
150擄C
200擄C
60 sec to
150 sec
3擄C/sec
SECOND-LEVEL ASSEMBLY
The ADIS16003 may be attached to the second-level assembly
board using SN63 (or equivalent) or lead-free solder. Figure 24
and Table 11 provide acceptable solder reflow profiles for each
solder type. Note: These profiles may not be the optimum
profile for the user鈥檚 application. In no case should 260擄C be
exceeded. It is recommended that the user develop a reflow
profile based upon the specific application. In general, keep in
mind that the lowest peak temperature and shortest dwell time
above the melt temperature of the solder results in less shock
and stress to the product. In addition, evaluating the cooling
rate and peak temperature can result in a more reliable
assembly.
183擄C
60 sec to
150 sec
240擄C +
0擄C/鈥?擄C
10 sec to
30 sec
6擄C/sec max
6 min max
217擄C
60 sec to
150 sec
260擄C +
0擄C/鈥?擄C
20 sec to
40 sec
6擄C/sec max
8 min max
Rev. 0 | Page 14 of 16

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