SPICE MODELS: SDMG0340L SDMG0340LA SDMG0340LC SDMG0340LS
SDMG0340L/LA/LC/LS
Lead-free Green
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
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Low Forward Voltage Drop
Fast Switching
Ultra-Small Surface Mount Package
PN Junction Guard Ring for Transient and ESD Protection
Lead Free/RoHS Compliant (Note 3 )
"Green" Device (Note 4 and 5)
B C
A
C
SOT-323
Dim
A
B
C
D
B
G
H
K
M
E
Min
0.25
1.15
2.00
0.30
1.20
1.80
0.0
0.90
0.25
0.10
0擄
Max
0.40
1.35
2.20
0.40
1.40
2.20
0.10
1.00
0.40
0.18
8擄
Mechanical Data
Case: SOT-323
Case Material: Molded Plastic, "Green" Molding
Compound, Note 5. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Solderable Per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over
Alloy 42 leadframe)
Terminal Connections: See Diagram
Marking: Date Code and Marking Code (See Diagrams &
Page 3)
Ordering Information (See Page 3)
Weight: 0.006 grams (approximate)
J
D
F
0.65 Nominal
E
G
H
J
L
K
L
M
a
All Dimensions in mm
TOP VIEW
SDMG0340L Marking: KSM
SDMG0340LA Marking: KSQ
SDMG0340LC Marking: KSP
SDMG0340LS Marking: KSN
Maximum Ratings
@ T
A
= 25擄C unless otherwise specified
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 1)
Non-Repetitive Peak Forward Surge Current @ t = 8.3ms
Power Dissipation (Note 1)
Thermal Resistance Junction to Ambient Air (Note 1)
Operating Temperature Range
Storage Temperature Range
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
FM
I
FSM
P
d
R
qJA
T
j
T
STG
@ T
A
= 25擄C unless otherwise specified
Symbol
V
(BR)R
V
F
I
R
C
T
Min
40
戮
戮
戮
Typ
戮
295
150
2.0
Max
戮
370
1000
戮
Unit
V
mV
nA
pF
Test Condition
I
R
= 10mA
I
F
= 1.0mA
V
R
= 10V
V
R
= 1V, f = 1.0MHz
Value
40
28
30
200
200
625
-40 to +125
-40 to +125
Unit
V
V
mA
mA
mW
擄C/W
擄C
擄C
Electrical Characteristics
Characteristic
Reverse Breakdown Voltage (Note 2)
Forward Voltage
Leakage Current (Note 2)
Total Capacitance
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration test pulse used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" Policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with date code 0609 (week 9, 2006) and newer are built with Green Molding Compound. Product manufactured prior to date
code 0609 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30248 Rev. 10 - 2
1 of 3
www.diodes.com
SDMG0340L/LA/LC/LS
茫
Diodes Incorporated
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