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MMUN2111LT1_05 Datasheet

  • MMUN2111LT1_05

  • ON Semiconductor [Bias Resistor Transistors]

  • ONSEMI

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MMUN2111LT1 Series
Preferred Devices
Bias Resistor Transistors
PNP Silicon Surface Mount Transistors
with Monolithic Bias Resistor Network
This new series of digital transistors is designed to replace a single
device and its external resistor bias network. The BRT (Bias Resistor
Transistor) contains a single transistor with a monolithic bias network
consisting of two resistors; a series base resistor and a base-emitter
resistor. The BRT eliminates these individual components by
integrating them into a single device. The use of a BRT can reduce
both system cost and board space. The device is housed in the SOT-23
package which is designed for low power surface mount applications.
Features
http://onsemi.com
PIN 3
COLLECTOR
(OUTPUT)
PIN 2
EMITTER
(GROUND)
PIN 1
BASE
(INPUT)
R1
R2
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
Simplifies Circuit Design
Reduces Board Space
Reduces Component Count
The SOT-23 package can be soldered using wave or reflow. The
modified gull-winged leads absorb thermal stress during soldering
eliminating the possibility of damage to the die.
鈥?/div>
Available in 8 mm embossed tape and reel.
鈥?/div>
Pb鈭扚ree Packages are Available
MAXIMUM RATINGS
(T
A
= 25擄C unless otherwise noted)
Rating
Collector-Base Voltage
Collector-Emitter Voltage
Collector Current
Symbol
V
CBO
V
CEO
I
C
Value
50
50
100
Unit
Vdc
Vdc
mAdc
MARKING
DIAGRAM
3
1
2
SOT鈭?3
CASE 318
STYLE 6
1
A6x M
G
G
A6x
x
M
G
= Device Code
= A 鈭?L (Refer to page 2)
= Date Code*
= Pb鈭扚ree Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation
T
A
= 25擄C
Derate above 25擄C
Thermal Resistance,
Junction-to-Ambient
Thermal Resistance,
Junction-to-Lead
Junction and Storage,
Temperature Range
Symbol
P
D
Max
246 (Note 1)
400 (Note 2)
1.5 (Note 1)
2.0 (Note 2)
508 (Note 1)
311 (Note 2)
174 (Note 1)
208 (Note 2)
鈭?5 to +150
Unit
mW
擄C/W
擄C/W
擄C/W
擄C
ORDERING INFORMATION
Device
MMUN21xxLT1
MMUN21xxLT1G
MMUN21xxLT3
MMUN21xxLT3G
Package
SOT鈭?3
SOT鈭?3
(Pb鈭扚ree)
SOT鈭?3
Shipping
鈥?/div>
3000/Tape & Reel
3000/Tape & Reel
10000/Tape & Reel
R
qJA
R
qJL
T
J
, T
stg
SOT鈭?3 10000/Tape & Reel
(Pb鈭扚ree)
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. FR鈭? @ Minimum Pad
2. FR鈭? @ 1.0 x 1.0 inch Pad
鈥燜or information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking table
on page 2 of this data sheet.
Preferred
devices are recommended choices for future use
and best overall value.
漏
Semiconductor Components Industries, LLC, 2005
1
August, 2005 鈭?Rev. 5
Publication Order Number:
MMUN2111LT1/D

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