M14C04 DD
M14C04 Die Description
PRODUCT
s
WAFER SIZE
s
s
s
s
M14C04
152 mm (6 inches)
1465 x 1585
碌m
101.6 x 101.6
碌m
100 x 100
碌m
DIE IDENTIFICATION M14C04KA_R
DIE SIZE (X x Y)
SCRIBE LINE
PAD OPENING
DIE LAYOUT
s
DI
s
s
s
Die Identification (at the position shown in Figure 1)
Pad contacts to the ISO pins (at the positions shown in Figure 1)
These ISO pins do not appear on the M14C04 die
This pad, shown in Figure 1, is Not Connected
C1, C2, C3, C5, C7
C4, C6, C8
NC
Pad locations are measured relative to the die centre (where X and Y are respectively the horizontal and
vertical axis, measured in
碌m).
Figure 1. M14C04 Die Plot
C7: SDA
(X= 鈥?32.3; Y= +609.6)
C5: GND
(X= +442.8; Y= +626.0)
NC: TEST
NC: TEST
DI
C3: SCL
(X= 鈥?52.0; Y= 鈥?09.76)
NC: TEST
C1: VCC
(X= +551.9; Y= 鈥?05.0)
AI02497
C2: WC
(X= 鈥?86.96; Y= 鈥?09.76)
DD.M14C04/9811V1.1
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