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B048F120T10 Datasheet

  • B048F120T10

  • VI Chip - BCM Bus Converter Module

  • 16頁(yè)

  • VICOR   VICOR

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V鈥 Chip 鈥?BCM
Bus Converter Module
TM
B048K120T10
1
鈥?48V to 12V V鈥 Chip Converter
鈥?100 Watt (150 Watt for 1 ms)
鈥?High density 鈥?up to 400 W/in
3
鈥?Small footprint 鈥?100 W/in
2
鈥?Low weight 鈥?0.4 oz (12 g)
鈥?Pick & Place / SMD
鈥?>96% efficiency
鈥?125擄C operation
鈥?<1 碌s transient response
鈥?>3.5 million hours MTBF
鈥?No output filtering required
鈥?V鈥 Chip BGA package
Actual size
漏
Vin = 42 - 53 V
Vout = 10.5 - 13.25 V
Iout = 8.3 A
K =
1
/
4
Rout = 32 m鈩?max
Product Description
The V鈥 Chip Bus Converter Module
(BCM) is a high efficiency (>96%),
narrow input range Voltage
Transformation Module (VTM) operating
from a pre-regulated 48 Vdc primary bus
to deliver an isolated 12 V secondary for
Intermediate Bus Architecture
applications. The BCM may be used to
power non-isolated POL converters or as
an independent 12 V source. Due to the
fast response time and low noise of the
BCM, the need for limited life aluminum
electrolytic or tantalum capacitors at the
input of POL converters is reduced鈥攐r
eliminated鈥攔esulting in savings of board
area, materials and total system cost.
Absolute Maximum Ratings
Parameter
+In to -In
+In to -In
PC to -In
TM to -In
SG to -In
+Out to -Out
Isolation voltage
Operating junction temperature
Output current
Values
-1.0 to 60.0
100
-0.3 to 7.0
-0.3 to 7.0
500
-0.5 to 15.0
1500
-40 to 125
8.3
Unit
Vdc
Vdc
Vdc
Vdc
Notes
For 100 ms
Peak output current
The BCM achieves a power density of
400 W/in
3
and may be surface mounted
with a profile as low as 0.16" (4mm) over
the PCB. Its V鈥 Chip power BGA package
is compatible with on-board or in-board
surface mounting. The V鈥 Chip package
provides flexible thermal management
through its low Junction-to-Case and
Junction-to-BGA thermal resistance.
Owing to its high conversion efficiency
and safe operating temperature range, the
BCM does not require a discrete heat sink
in typical applications. It is also
compatible with heat sink options,
assuring low junction temperatures and
long life in the harshest environments.
P
L
E
R
R
胃JC
R
胃JB
R
胃JA
R
胃JA
Case temperature during reflow
Storage temperature
Output power
Peak output power
IN
IM
12.5
208
-40 to 150
100
150
Parameter
Junction-to-case
Junction-to-BGA
Junction-to-ambient
3
Junction-to-ambient
4
Y
R
A
mA
Vdc
Vdc
擄C
A
See note 2
Continuous
For 1 ms
A
擄C
擄C
W
W
Continuous
For 1 ms
Typ
1.1
2.1
Max
1.5
2.5
Units
擄C/W
擄C/W
擄C/W
擄C/W
Input to Output
Thermal Resistance
Symbol
6.5
5.0
7.2
5.5
Notes
1. For complete product matrix see chart on page 10.
2. The referenced junction is defined as the semiconductor having the highest temperature. This
temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator.
3. B048K120T10 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
4. B048L120T10 (0.25"H integral Pin Fins) surface mounted on FR4 board, 300 LFM.
45
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V鈥 Chip Bus Converter
B048K120T10
Rev. 1.2
Page 1 of 16

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