TN16 and TYNx16 Series
Fig. 1:
Maximum average power dissipation
versus average on-state current.
P(W)
16
14
12
10
8
6
4
2
0
0
2
4
IT(av)(A)
6
8
偽
360擄
Fig. 2-1:
Average and D.C. on-state current
versus case temperature.
IT(av)(A)
18
16
14
12
10
8
6
4
2
0
D.C.
偽
= 180擄
偽
=180擄
Tcase(擄C)
0
25
50
75
100
125
10
12
Fig. 2-2:
Average and D.C. on-state current
versus ambient temperature (copper surface
under tab: S = 1 cm虜 (for D虜PAK).
IT(av)(A)
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
25
Tamb(擄C)
50
75
100
125
偽
= 180擄
D.C.
Fig. 3:
Relative variation of thermal impedance
versus pulse duration.
K = [Zth/Rth]
1.00
Zth(j-c)
0.10
Zth(j-a)
tp(s)
0.01
1E-3
1E-2
1E-1
1E+0
1E+1
1E+2 5E+2
Fig. 4:
Relative variation of gate trigger current,
holding current and latching current versus
junction temperature.
IGT,IH,IL [Tj] / IGR,IH,IL [Tj = 25 擄C]
2.5
2.0
IGT
Fig. 5:
Surge peak on-state current versus
number of cycles.
ITSM(A)
200
180
160
140
120
100
80
60
40
20
0
tp = 10ms
Non repetitiv e
Tj initial = 25 擄C
Repetitive
Tcase = 110 擄C
One cycle
1.5
1.0
0.5
Tj(擄C)
0.0
-40
-20
0
20
40
60
80
100
120
140
IH & IL
Number of cycles
1
10
100
1000
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