P0406FC3.3C*
thru
P0406FC36C*
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
PACKAGE DIMENSIONS
DIM
A
B
C
MILLIMETERS
0.56 NOM
0.86 NOM
0.99 鹵 0.0254
0.15 SQ
1.5 鹵 0.0254
0.15 NOM
0.127 MAX
0.076 MIN
I
0.406 NOM
INCHES
0.022 NOM
0.034 NOM
0.039 鹵 0.001
0.006 SQ
0.059 鹵 0.001
0.006 NOM
0.005 MAX
0.003 MIN
0.016 NOM
A
B
C
TOP
SIDE
E
F
G
H
G
E
F
H
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx 鹵 0.05mm (鹵 0.002鈥?.
END
I
MOUNTING PAD LA
YOUT - Option 1
DIM
C
A
D
A
C
D
E
F
G
H
I
NOTE:
PAD DIMENSIONS
MILLIMETERS
0.51
0.30
0.46
0.20
0.15 SQ
0.71
0.99
0.51
INCHES
0.020
0.012
0.018
0.008
0.006 SQ
0.028
0.039
0.020
DIE
SOLDER
BUMPS
E
H
G
1.
Preferred:
Using 0.1mm (0.004鈥? stencil.
I
SOLDER PADS
SOLDER PRINT
0.010鈥?- 0.012鈥?DIA.
SOLDER MASK
F
Outline & Dimensions: Rev 3 - 11/02, 06023
*U.S. Patent No. Des. 鈥淒456,367S鈥?/div>
05155.R4 3/05
5
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