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P0406FC36C Datasheet

  • P0406FC36C

  • FLIP CHIP ARRAY

  • 6頁

  • ETC

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P0406FC3.3C*
thru
P0406FC36C*
APPLICA
TION INFORMA
TION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183擄C)
Soldering Maximum Temperature
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
鹵50碌m
鹵20碌m
60 Seconds
270擄C
VALUE
REQUIREMENTS
Temperature:
T
P
for Lead-Free (SnAgCu): 260-265擄C
T
P
for Tin-Lead: 240-245擄C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
T
P
Ramp-up
Temperature - 擄C
Ramp-down
T
L
T
SMAX
155擄
T
SMIN
140擄
T
S
- Preheat
t 25擄C to Peak
30-60 seconds
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
*U.S. Patent No. Des. 鈥淒456,367S鈥?/div>
05155.R4 3/05
4
www.protekdevices.com

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