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TZA3034 Datasheet

  • TZA3034

  • SDH/SONET STM1/OC3 postamplifier

  • 147.23KB

  • 28頁(yè)

  • PHILIPS

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Philips Semiconductors
Product speci鏗乧ation
SDH/SONET STM1/OC3 postampli鏗乪r
DEFINITIONS
Data sheet status
Objective speci鏗乧ation
Preliminary speci鏗乧ation
Product speci鏗乧ation
Limiting values
TZA3034
This data sheet contains target or goal speci鏗乧ations for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains 鏗乶al product speci鏗乧ations.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the speci鏗乧ation
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the speci鏗乧ation.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
BARE DIE DISCLAIMER
All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of
ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately
indicated in the data sheet. There is no post waffle pack testing performed on individual die. Although the most modern
processes are utilized for wafer sawing and die pick and place into waffle pack carriers, Philips Semiconductors has no
control of third party procedures in the handling, packing or assembly of the die. Accordingly, Philips Semiconductors
assumes no liability for device functionality or performance of the die or systems after handling, packing or assembly of
the die. It is the responsibility of the customer to test and qualify their application in which the die is used.
1999 Nov 03
25

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