PRELIMINARY
Mechanical Specifications
1,00
0.039
SOLDER BALL
#A1 INDICATOR
V鈥 Chip Pre-Regulator Module
18,00
0.709
9,00
0.354
1,00
0.039
SOLDER BALL #A1
21,5
0.85
5,9
0.23
(88) X 酶
0,51
SOLDER BALL
0.020
OUTPUT
30,00
1.181
INPUT
INPUT
OUTPUT
32,0
1.26
28,8
1.13
16,0
0.63
C
L
15,00
0.591
TOP VIEW (COMPONENT SIDE)
1,6
0.06
C
L
BOTTOM VIEW
1,00
0.040
3,8
0.15
NOTES:
mm
1- DIMENSIONS ARE inch .
2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
3- PRODUCT MARKING ON TOP SURFACE
15,7
0.62
SEATING PLANE
DXF and PDF files are available on vicorpower.com
Figure 17
鈥?PRM BGA mechanical outline; Inboard mounting
INBOARD MOUNTING
BGA surface mounting requires a cutout in the
PCB in which to recess the V鈥 Chip
( 酶 0,51 )
0.020
SOLDER MASK
DEFINED PADS
0,50
0.020
1,50
0.059
1,00
0.039
0,53
酶 0.021 PLATED VIA
CONNECT TO
INNER LAYERS
0,50
TYP
0.020
2,00
0.079
1,00
0.039
SOLDER PAD #A1
VC
18,00
0.709
9,00
0.354
1,00
0.039
VH SC SG
1
PC
TM
OS NC CD
NC
IL
28,00
(2) X
1.102
(2) X
24,00
0.945
(2) X
20,00
0.787
10,00
(2) X 0.394
30,00
(2) X 1.181
(2) X 26,00
1.024
(2) X
22,00
0.866
PCB CUTOUT
RECOMMENDED LAND PATTERN
AND INNER LAYER INTERCONNECT
(COMPONENT SIDE SHOWN)
PR
+OUT
+IN
(4) X 7,00
0.276
NOTES:
mm
1- DIMENSIONS ARE inch .
2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
-OUT
-IN
31
AB
CD
(88) X 酶 0,51
0.020
SOLDER MASK
DEFINED PAD
8,08
0.318
16,16
0.636
DXF and PDF files are available on vicorpower.com
(4) X R 1,6
0.06
Figure 18
鈥?PRM BGA PCB land / VIA layout information; Inboard mounting
vicorpower.com
800-735-6200
V鈥 Chip Pre-Regulator Module
P048K048T24AL
Rev. 1.4
Page 11 of 15