Philips Semiconductors
Product speci鏗乧ation
SDH/SONET STM4/OC12 and
1.25 Gbits/s Gigabit Ethernet postampli鏗乪rs
TZA3044; TZA3044B
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
D
E
A
X
c
y
H
E
v
M
A
Z
16
9
Q
A
2
pin 1 index
A
1
胃
L
p
L
(A
3
)
A
1
e
b
p
8
w
M
detail X
0
2.5
scale
5 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
max.
1.10
A
1
0.15
0.05
A
2
0.95
0.80
A
3
0.25
b
p
0.30
0.19
c
0.2
0.1
D
(1)
5.1
4.9
E
(2)
4.5
4.3
e
0.65
H
E
6.6
6.2
L
1.0
L
p
0.75
0.50
Q
0.4
0.3
v
0.2
w
0.13
y
0.1
Z
(1)
0.40
0.06
胃
8
0
o
o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT403-1
REFERENCES
IEC
JEDEC
MO-153
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
94-07-12
95-04-04
1999 Nov 03
23