Philips Semiconductors
Product speci鏗乧ation
SDH/SONET STM4/OC12 and
1.25 Gbits/s Gigabit Ethernet postampli鏗乪rs
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
V
CC
V
n
supply voltage
DC voltage
pins DIN, DINQ, CF, JAM and RSET
pins ST, STQ, DOUT and DOUTQ
pin V
ref
I
n
DC current
pins DIN, DINQ, CF and JAM
pins ST, STQ, DOUT and DOUTQ
pin V
ref
pin RSET
P
tot
T
stg
T
j
T
amb
Note
1. For the TZA3044B the minimum value is
鈭?.5
V for ST and STQ outputs.
HANDLING
total power dissipation
storage temperature
junction temperature
ambient temperature
note 1
PARAMETER
CONDITIONS
TZA3044; TZA3044B
MIN.
鈭?.5
鈭?.5
V
CC
鈭?/div>
2
鈭?.5
鈭?
鈭?5
鈭?
鈭?
鈭?/div>
鈭?5
鈭?/div>
鈭?0
MAX.
+6
V
CC
+ 0.5
V
CC
+ 0.5
+3.2
+1
+10
+2.5
+2
300
+150
150
+85
V
V
V
V
UNIT
mA
mA
mA
mA
mW
擄C
擄C
擄C
This device is ESD sensitive and should be handled with care. Precautions should be taken to avoid damage through
electrostatic discharge. This is particularly important during assembly and handling of the bare die. Additional safety can
be obtained by bonding the V
CC
and GND pads first, the remaining pads may then be bonded to their external
connections in any order.
THERMAL CHARACTERISTICS
SYMBOL
R
th(j-a)
PARAMETER
thermal resistance from junction to ambient
SO16 package
TSSOP16 package
Note
1. Thermal resistance from junction to ambient is determined with the IC soldered on a standard single-sided
57
脳
57
脳
1.6 mm FR4 epoxy printed-circuit board with 35
碌m
thick copper traces. The measurements are performed
in still air.
CONDITIONS
note 1
115
150
K/W
K/W
VALUE
UNIT
1999 Nov 03
10
                         
                        
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