PRELIMINARY
Configuration Options
Configuration
Effective power density
Junction-Board
thermal resistance
Junction-Case
thermal resistance
Junction-Ambient
thermal resistance 300LFM
Notes:
Inboard
(1)
(Figure 14)
1400 W/in
3
2.1 擄C/W
1.1 擄C/W
6.5 擄C/W
Onboard
(1)
(Figure 15)
880 W/in
3
2.4 擄C/W
1.1 擄C/W
6.8 擄C/W
Inboard with 0.25"
Pin Fins
(2)
550 W/in
3
2.1 擄C/W
N/A
5.0 擄C/W
Onboard with 0.25"
Pin Fins
(2)
440 W/in
3
2.4 擄C/W
N/A
5.0 擄C/W
(1) Surface mounted to a 2" x 2" FR4 board, 4 layers 2 oz Cu
(2) Pin Fin heat sink available as a separate item
21.5
0.85
22.0
0.87
32.0
1.26
32.0
1.26
4.0
0.16
6.3
0.25
INBOARD MOUNT
(V鈥 Chip recessed into PCB)
mm
in
ONBOARD MOUNT
mm
in
Figure 14鈥擨nboard
mounting 鈥?package K
Figure 15鈥擮nboard
mounting 鈥?package F
vicorpower.com
800-735-6200
V鈥 Chip Voltage Transformation Module
V048K096T025
Rev. 1.0
Page 9 of 15