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B048K060T24 Datasheet

  • B048K060T24

  • VI Chip - BCM Mus Converter Module

  • 567.08KB

  • 15頁

  • VICOR   VICOR

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PRELIMINARY
Configuration Options
V鈥 Chip Bus Converter Module
Configuration
Effective power density
Junction-Board
thermal resistance
Junction-Case
thermal resistance
Junction-Ambient
thermal resistance 300LFM
Inboard
(1)
(Package K)
1400 W/in
3
2.1 擄C/W
1.1 擄C/W
Onboard
(1)
(Package F)
880 W/in
3
2.4 擄C/W
1.1 擄C/W
Inboard with 0.25"
Pin Fins
(2)
550 W/in
3
2.1 擄C/W
N/A
Onboard with 0.25"
Pin Fins
(2)
440 W/in
3
2.4 擄C/W
N/A
6.5 擄C/W
6.8 擄C/W
5.0 擄C/W
5.0 擄C/W
Notes:
(1) Surface mounted to a 2" x 2" FR4 board, 4 layers 2 oz Cu
(2) Pin Fin heat sink available as a separate item
21.5
0.85
22.0
0.87
32.0
1.26
32.0
1.26
4.0
0.16
6.3
0.25
INBOARD MOUNT
(V鈥 Chip recessed into PCB)
mm
in
ONBOARD MOUNT
mm
in
Figure 19鈥擨nboard
mounting 鈥?package K
Figure 20鈥?/div>
Onboard mounting 鈥?package F
Input reflected ripple
measurement point
F1
7A
Fuse
+In
Enable/Disable Switch
+Out
+
R3
10 m鈩?/div>
typ.
C3
10 碌F
C1
100 碌F
electrolytic
SW1
2K
鈩?/div>
R2
TM
RSV
PC
BCM
K
Ro
-Out
Load
D1
-In
+Out
-Out
鈥?/div>
Notes:
Source inductance should be no more than 200 nH. If source inductance is
greater than 200 nH, additional bypass capacitance may be required.
C3 should be placed close to the load.
R3 may be ESR of C3 or a seperate damping resistor.
D1 power good indicator will dim when a module fault is detected.
Figure 21鈥擝CM
test circuit
vicorpower.com
800-735-6200
V鈥 Chip Bus Converter Module
B048K060T24
Rev. 1.0
Page 10 of 15

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