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V048K020T080 Datasheet

  • V048K020T080

  • VI Chip - PRM-AL Pre-regulator Module

  • 544.38KB

  • 15頁(yè)

  • VICOR   VICOR

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上傳產(chǎn)品規(guī)格書

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PRELIMINARY
Electrical Specifications
(continued)
Thermal
Symbol
Parameter
Over temperature shutdown
Thermal capacity
Junction-to-case thermal impedance
Junction-to-BGA thermal impedance
Junction-to-ambient
(1)
Junction-to-ambient
(2)
Min
125
Typ
130
0.61
1.1
2.1
6.5
5.0
Max
135
Unit
擄C
Ws/擄C
擄C/W
擄C/W
擄C/W
擄C/W
Note
Junction temperature
R
胃JC
R
胃JB
R
胃JA
R
胃JA
Notes:
(1) P048K048T24AL surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
(2) P048K048T24AL with a 0.25"H heatsink surface mounted on FR4 board, 300 LFM.
V鈥 Chip Stress Driven Product Qualification Process
Test
High Temperature Operational Life (HTOL)
Temperature cycling
High temperature storage
Moisture resistance
Temperature Humidity Bias Testing (THB)
Pressure cooker testing (Autoclave)
Highly Accelerated Stress Testing (HAST)
Solvent resistance/marking permanency
Mechanical vibration
Mechanical shock
Electro static discharge testing 鈥?human body model
Electro static discharge testing 鈥?machine model
Highly Accelerated Life Testing (HALT)
Dynamic cycling
Note:
(1) For details of the test protocols see Vicor鈥檚 website.
Standard
JESD22-A-108-B
JESD22-A-104B
JESD22-A-103A
JESD22-A113-B
EIA/JESD22-A-101-B
JESD22-A-102-C
JESD22-A-110B
JESD22-B-107-A
JESD22-B-103-A
JESD22-B-104-A
EIA/JESD22-A114-A
EIA/JESD22-A115-A
Per Vicor Internal
Test Specification
(1)
Per Vicor internal
test specification
(1)
Environment
125擄C, Vmax, 1,008 hrs
-55擄C to 125擄C, 1,000 cycles
150擄C, 1,000 hrs
Moisture sensitivity Level 5
85擄C, 85% RH, Vmax, 1,008 hrs
121擄C, 100% RH, 15 PSIG, 96 hrs
130擄C, 85% RH, Vmax, 96 hrs
Solvents A, B & C as defined
20g peak, 20-2,000 Hz, test in X, Y & Z directions
1,500g peak 0.5 ms pulse duration, 5 pulses in 6 directions
Meets or exceeds 2,000 Volts
Meets or exceeds 200 Volts
Operation limits verified, destruct margin determined
Constant line, 0-100% load, -20擄C to 125擄C
V鈥 Chip Ball Grid Array Interconnect Qualification
Test
BGA solder fatigue evaluation
Solder ball shear test
Standard
IPC-9701
IPC-SM-785
IPC-9701
Environment
Cycle condition: TC3 (-40 to +125擄C)
Test duration: NTC-B (500 failure free cycles)
Failure through bulk solder or copper pad lift-off
vicorpower.com
800-735-6200
V鈥 Chip Pre-Regulator Module
P048K048T24AL
Rev. 1.4
Page 7 of 15

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