Mechanical Drawings
PRELIMINARY
1,00
0.039
1,00
0.039
9,00
0.354
SOLDER BALL #A1
18,00
0.709
SOLDER BALL
#A1 INDICATOR
21,5
0.85
6,0
0.24
(106) X 酶
0,51
SOLDER BALL
0.020
1,00
TYP
0.039
OUTPUT
30,00
1.181
INPUT
INPUT
OUTPUT
32,0
1.26
28,8
1.13
16,0
0.63
C
L
15,00
0.591
TOP VIEW (COMPONENT SIDE)
1,6
0.06
C
L
BOTTOM VIEW
1,00
0.039
4,0
0.16
NOTES:
mm
1- DIMENSIONS ARE inch .
2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
3- PRODUCT MARKING ON BOTH TOP AND BOTTOM SURFACES
15,7
0.62
SEATING PLANE
Figure 16鈥擵TM
BGA mechanical outline; In-board mounting
IN-BOARD MOUNTING
BGA surface mounting requires a
cutout in the PCB in which to recess the V鈥 Chip
0,51
(酶
)
0.020
SOLDER MASK
DEFINED PADS
1,50
0.059
( 1,00 )
0.039
0,50
0.020
酶 0,53 PLATED VIA
0.021
CONNECT TO
INNER LAYERS
0,50
0.020
( 1,00 )
0.039
1,00
0.039
9,00
0.354
18,00
0.709
1,00
0.039
1,00
0.039
SOLDER PAD #A1
(2) X 10,00
0.394
+IN
(4) X 6,00
0.236
+OUT1
-OUT1
RECOMMENDED LAND AND VIA PATTERN
TM
(COMPONENT SIDE SHOWN)
PCB CUTOUT
SG
29,26
1.152
24,00
0.945
16,00
0.630
8,00
0.315
0,37
0.015
1,6
(4) X R 0.06
NOTES:
mm
1- DIMENSIONS ARE inch .
2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
20,00
0.787 17,00
0.669 15,00 13,00
0.591
0.512
+OUT2
-IN
PC
-OUT2
(106) X 酶
0,51
0.020
8,08
0.318
16,16
0.636
SOLDER MASK
DEFINED PAD
Figure 17鈥?/div>
VTM BGA PCB land/VIA layout information; In-board mounting
45
Vicor Corporation Tel: 800-735-6200 vicorpower.com
V鈥 Chip Voltage Transformation Module
Rev. 1.6
Page 8 of 20
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