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D16311GC Datasheet

  • D16311GC

  • 1/8- to 1/16-DUTY FIPTM VFD CONTROLLER/DRIVER

  • 20頁

  • NEC   NEC

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PD16311
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product. Please consult with our sales
officers in case other soldering process is used or in case soldering is done under different conditions.

PD16311GC-AB6
Soldering process
Infrared ray reflow
Soldering conditions
Peak package鈥檚 surface temperature: 235

C or below,
Reflow time: 30 seconds or below (210

C or higher),
Number of reflow process: 2, Exposure limit*: None
Peak package鈥檚 surface temperature: 215

C or below,
Reflow time: 40 seconds or below (200

C or higher),
Number of reflow process: 2, Exposure limit*: None
Solder temperature: 260

C or below,
Flow time: 10 seconds or below,
Number of flow process: 1, Exposure limit*: None
Terminal temperature: 300

C or below,
Flow time: 10 seconds or below,
Exposure limit*: None
Symbol
IR35-00-2
VPS
VP15-00-2
Wave soldering
WS60-00-1
Partial heating method
*
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25

C and relative humidity at 65 % or less.
Note
Do not apply more than a single process at once, except for 鈥淧artial heating method鈥?
16

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