P0404FC3.3C*
thru
P0404FC36C*
PACKAGE OUTLINE & DIMENSIONS
MOUNTING PAD LA
YOUT - Option 2
DIM
COPPER
CONTACTS
0.009鈥?[0.23] DIA.
PAD DIMENSIONS
Millimeters
0.51
0.15 SQ
0.71
0.99
0.51
Inches
0.020
0.006 SQ
0.028
0.039
0.020
A
A
F
G
H
DIE
SOLDER
BUMP
I
I
NOTES:
1. Controlling dimensions in
inches.
2. Decimal tolerances for
mounting pad and
outline:
.xxx 鹵 0.05mm (鹵 0.002鈥?.
3.
Preferred:
Using 0.1mm (0.004鈥?
stencil.
H
G
SOLDER PRINT
0.014鈥?- [0.36] DIA.
SOLDER MASK
F
06022 Rev 3 - 11/02
COPYRIGHT 漏 ProTek Devices 2003
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without
notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final
judgement concerning selection and specifications is the buyer鈥檚 and that in furnishing engineering and technical assistance,
ProTek assumes no responsibility with respect to the selection or specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
Web Site: www.protekdevices.com
* U.S. Patent No. Des. 鈥淒456,367 S鈥?/div>
05154.R2 11/02
5
www.protekdevices.com
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