P0406FC3.3C*
thru
P0406FC36C*
GRAPHS
FIGURE 3
POWER DERATING CURVE
Peak Pulse Power
8/20碌s
225擄C
5-10 sec
60
200擄C
Instantaneous
to 200擄C
100
80
% Of Rated Power
FIGURE 4
REFLOW SOLDER PROFILE
40
20
Average Power
0
0
25
50
75
100
125
T
L
- Lead Temperature - 擄C
150
Pre-Heat
Time
Soldering
Time
Cool Down
Time
100擄C
1-2 Minutes
to 150擄C
1-2 Minutes to 25擄C
Note:
This reflow profile does not take into account the printed circuit board (PCB) material
heating time. Additional time may be required for the preheat time and cool down time upon the
PCB or board material.
FIGURE 5
OVERSHOOT & CLAMPING VOLTAGE FOR P0406FC05C
40
5 Volts per Division
30
20
10
0
ESD Test Pulse - 12 kilovolt, 1/30ns (waveshape)
FIGURE 6
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR P0406FC05C
14
12
10
8
6
4
2
0
0
5
10
I
PP
- Peak Pulse Current - Amps
15
20
V
C
- Clamping Voltage - Volts
* U.S. Patent No. Des. 鈥淒456,367 S鈥?/div>
05155.R2 11/02
3
www.protekdevices.com
prev
next