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JAHW050A1 Datasheet

  • JAHW050A1

  • Analog IC

  • 16頁(yè)

  • ETC

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JAHW050A and JAHW075A Power Modules:
dc-dc Converters; 36 Vdc to 75 Vdc Input, 5 Vdc Output; 50 W to 75 W
Data Sheet
June 2000
General Specifications
Parameter
Calculated MTBF (I
O
= 80% of I
O, max
; T
C
= 40 擄C)
Weight
鈥?/div>
Min
Typ
2,000,000
鈥?/div>
100 (3.5)
Max
Unit
hours
g (oz.)
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See Feature Descriptions for additional information.
Parameter
Remote On/Off Signal Interface
(V
I
= 0 V to 75 V; open collector or equivalent compatible;
signal referenced to V
I
(鈥? terminal; see Figure 15 and
Feature Descriptions.):
JAHWxxxA1 Preferred Logic:
Logic Low鈥擬odule On
Logic High鈥擬odule Off
JAHWxxxA Optional Logic:
Logic Low鈥擬odule Off
Logic High鈥擬odule On
Logic Low:
At I
on/off
= 1.0 mA
At V
on/off
= 0.0 V
Logic High:
At I
on/off
= 0.0 碌A(chǔ)
Leakage Current
Turn-on Time (See Figure 11.)
(I
O
= 80% of I
O, max
; V
O
within 鹵1% of steady state)
Output Voltage Adjustment (See Feature Descriptions.):
Output Voltage Remote-sense Range
Output Voltage Set-point Adjustment Range (trim)
Output Overvoltage Protection
Overtemperature Protection
(See Feature Descriptions.)
* These are manufacturing test limits. In some situations, results may differ.
Symbol
Min
Typ
Max
Unit
V
on/off
I
on/off
V
on/off
I
on/off
鈥?/div>
0
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
20
1.2
1.0
15
50
35
V
mA
V
碌A(chǔ)
ms
鈥?/div>
鈥?/div>
V
O, sd
T
C
鈥?/div>
60
5.9*
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
110
0.5
110
7.0*
鈥?/div>
V
%V
O, nom
V
擄C
Solder, Cleaning, and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly process prior to electrical testing. The result of inad-
equate circuit-board cleaning and drying can affect both the reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on appropriate soldering, cleaning, and drying procedures refer to
Lucent Technologies
Board-Mounted Power Modules Soldering and Cleaning
Application Note (AP97-021EPS).
4
Lucent Technologies Inc.

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