Philips Semiconductors
PZUxB series
Single Zener diodes in a SOD323F package
8. Package outline
1.35
1.15
1
0.5
0.3
0.80
0.65
2.7
2.3
1.8
1.6
2
0.40
0.25
Dimensions in mm
0.25
0.10
04-09-13
Fig 5. Package outline SOD323F (SC-90)
9. Packing information
Table 10. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number
PZU2.4B to
PZU36B
[1]
Package
SOD323F
Description
4 mm pitch, 8 mm tape and reel
Packing quantity
3000
-115
10000
-135
For further information and the availability of packing methods, see
Section 14.
10. Soldering
3.05
2.80
2.10
1.60
solder lands
solder resist
1.65
0.95
0.50
0.60
occupied area
solder paste
0.50
(2脳)
001aab169
Re鏗俹w soldering is the only recommended soldering method.
Dimensions in mm
Fig 6. Re鏗俹w soldering footprint SOD323F (SC-90)
PZUXB_SER_1
漏 Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 鈥?7 March 2006
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