5. Limiting values
Table 5.
In accordance with the Absolute Maximum Rating System (IEC 60134).
鈮?/div>
25
擄C
[2]
[3]
t
p
= 100
碌s;
square wave; T
j
= 25
擄C
prior to surge
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
2
.
6. Thermal characteristics
Table 6.
Symbol
R
th(j-a)
R
th(j-sp)
[1]
[2]
[3]
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to solder point
Conditions
in free air
[1]
[2]
[3]
Min
-
-
-
Typ
-
-
-
Max
400
230
55
Unit
K/W
K/W
K/W
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
2
.
Soldering point of cathode tab.
7. Characteristics
Table 7.
Characteristics
T
j
= 25
擄
C unless otherwise speci鏗乪d.
Symbol
V
F
Parameter
forward voltage
Conditions
I
F
= 10 mA
I
F
= 100 mA
[1]
Pulse test: t
p
鈮?/div>
300
碌s; 未 鈮?/div>
0.02.
[1]
[1]
Min
-
-
Typ
-
-
Max
0.9
1.1
Unit
V
V
PZUXB_SER_1
漏 Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 鈥?7 March 2006
3 of 12
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