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L2K2-MWC4-11-0180 Datasheet

  • L2K2-MWC4-11-0180

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JEDEC Moisture Sensitivity
Table 7.
Soak Requirements
Level
Time
2a
4
weeks
Floor Life
Conditions
鈮?/div>
30擄C /
60% RH
Standard
Time
Conditions
(hours)
696
[1]
+ 5/ 0
30擄C /
60% RH
Accelerated Environment
Time
Conditions
(hours)
120
+1/ 0
60擄C /
60% RH
Note for Table 7:
1. The standard soak time includes a default value of 24 hours for semiconductor manufacturer's exposure time (MET)
between bake and bag and includes the maximum time allowed out of the bag at the distributor's facility.
Reflow Soldering Characteristics
[1]
JEDEC 020c
Table 8.
Profile Feature
Average Ramp Up Rate (Ts
max
to T
p
)
Preheat Temperature Min (Ts
min
)
Preheat Temperature Max (Ts
max
)
Preheat Time (ts
min
to ts
max
)
Temperature (T
L
)
Time Maintained Above Temperature (T
L
)
Peak / Classification Temperature (T
P
)
Time Within 5擄C of Actual Peak Temperature (T
P
)
Ramp Down Rate
Time 25擄C to Peak Temperature
Lead Free Assembly
3擄C / second max
150擄C
200擄C
60 180 seconds
217擄C
60 150 seconds
260擄C
20 40 seconds
6擄C / second max
8 minutes max
Notes for Table 8:
1. All temperatures refer to topside of the package, measured on the package body surface.
LUXEON K2 with TFFC Datasheet DS60 (10/07)
8

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