PRELIMINARY
Configuration Options
Standard
(1)
(Figure 21)
875 W/in
3
2.4 擄C/W
1.1 擄C/W
6.8 擄C/W
V鈥 Chip Pre-Regulator Module
Configuration
Effective power density
Effective Junction-Board
thermal resistanc
Effective Junction-Case
thermal resistance
Effective Junction-Ambient
thermal resistance 300LFM
Note:
(1) Surface mounted to a 2" x 2" FR4 board, 4 layers 2 oz Cu
(2) Heat sink available as a separate item
Standard with 0.25"
Heat Sink
(2)
437 W/in
3
2.4 擄C/W
N/A
5.0 擄C/W
22.0
0.87
32.0
1.26
6.3
0.25
STANDARD MOUNT
mm
in
Figure 21鈥擲tandard
mounting 鈥?package F
Figure 22鈥擧ole
location for push pin heatsink relative to VIC
Thermal
Symbol
Parameter
Over temperature shutdown
Thermal capacity
Junction-to-case thermal impedance
Junction-to-board thermal impedance
Junction-to-ambient
(1)
Junction-to-ambient
(2)
Min
125
Typ
130
0.61
1.1
2.1
6.5
5.0
Max
135
Unit
擄C
Ws/擄C
擄C/W
擄C/W
擄C/W
擄C/W
Note
Junction temperature
R
胃JC
R
胃JB
R
胃JA
R
胃JA
Notes:
(1) P048F048T24AL surface mounted to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
(2) P048F048T24AL with a 0.25"H heatsink surface mounted on FR4 board, 300 LFM.
vicorpower.com
800-735-6200
V鈥 Chip Pre-Regulator Module
P048F048T24AL
Rev. 1.7
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