MCP1726
8-Lead Plastic Dual Flat No Lead Package (MF) 3x3x0.9 mm Body (DFN) 鈥?Saw Singulated
D
p
b
n
L
EXPOSED
METAL
PAD
E
E2
PIN 1
ID INDEX
AREA
(NOTE 2)
2
1
TOP VIEW
D2
BOTTOM VIEW
ALTERNATE EXPOSED
PAD CONFIGURATIONS
A1
A
A3
EXPOSED
TIE BAR
(NOTE 1)
Units
Dimension Limits
n
p
A
A1
A3
E
E2
D
D2
b
L
INCHES
NOM
8
.026 BSC
.035
.001
.008 REF.
.118 BSC
-
.118 BSC
-
.012
.016
MILLIMETERS*
MIN
NOM
8
0.65 BSC
0.80
0.90
0.00
0.02
0.20 REF.
3.00 BSC
1.40
-
3.00 BSC
-
2.15
0.30
0.23
0.20
0.40
MIN
MAX
MAX
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Exposed Pad Width
Overall Width
Exposed Pad Length
Contact Width
Contact Length
.031
.000
.039
.002
1.00
0.05
(Note 3)
.055
.085
.009
.008
.069
.096
.015
.020
1.75
2.45
0.37
0.50
(Note 3)
*Controlling Parameter
Notes:
1. Package may have one or more exposed tie bars at ends.
2. Pin 1 visual index feature may vary, but must be located within the hatched area.
3. Exposed pad dimensions vary with paddle size.
4. JEDEC equivalent: MO-229
Drawing No. C04-062
Revised 03/11/05
DS21936B-page 22
漏
2005 Microchip Technology Inc.