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MSP430F2481TRGCR Datasheet

  • MSP430F2481TRGCR

  • Texas Instruments [MIXED SIGNAL MICROCONTROLLER]

  • TI

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PACKAGE OPTION ADDENDUM
www.ti.com
20-Nov-2007
Orderable Device
MSP430F249TRGC
MSP430F249TRGCR
MSP430F249TRGCT
(1)
Status
(1)
PREVIEW
ACTIVE
ACTIVE
Package
Type
QFN
QFN
QFN
Package
Drawing
RGC
RGC
RGC
Pins Package Eco Plan
(2)
Qty
64
64
64
250
2500
250
TBD
TBD
TBD
Lead/Ball Finish
Call TI
Call TI
Call TI
MSL Peak Temp
(3)
Call TI
Call TI
Call TI
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The
information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2

MSP430F2481TRGCR 產(chǎn)品屬性

  • The Ultra-Low Power MSP430MSP430 OverviewMSP430 Design ToolsMSP430 PeripheralsMSP430x2xx/4xx and Wireless OverviewPortable Medical Solutions with MSP430MSP430 for Utility Metering SolutionsMSP430: How to JTAGMSP430, How To Use the Clock SystemGrace Software Graphical User InterfaceMCU OverviewDriver LibraryMSP430Ware Overview

  • 1

  • 集成電路 (IC)

  • 嵌入式 - 微控制器，

  • MSP430F2xx

  • RISC

  • 16-位

  • 16MHz

  • I²C，IrDA，LIN，SCI，SPI，UART/USART

  • 欠壓檢測(cè)/復(fù)位，POR，PWM，WDT

  • 48

  • 48KB（48K x 8 + 256B）

  • 閃存

  • -

  • 4K x 8

  • 1.8 V ~ 3.6 V

  • -

  • 內(nèi)部

  • -40°C ~ 105°C

  • 64-VFQFN 裸露焊盤

  • Digi-Reel®

  • 296-23083-6

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