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MSP430F247TRGC Datasheet

  • MSP430F247TRGC

  • Texas Instruments [MIXED SIGNAL MICROCONTROLLER]

  • 1652.55KB

  • TI

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MSP430x23x, MSP430x24x(1), MSP430x2410
MIXED SIGNAL MICROCONTROLLER
SLAS547A -- JUNE 2007 -- REVISED NOVEMBER 2007
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
crystal oscillator, LFXT1, high frequency modes (see Note 5)
PARAMETER
f
LFXT1,HF0
f
LFXT1,HF1
LFXT1 oscillator crystal frequency,
HF mode 0
LFXT1 oscillator crystal frequency,
HF mode 1
LFXT1 oscillator crystal frequency,
ill t
t lf
HF mode 2
TEST CONDITIONS
XTS = 1, LFXT1Sx = 0, XCAPx = 0
XTS = 1, LFXT1Sx = 1, XCAPx = 0
VCC
1.8 V to 3.6 V
1.8 V to 3.6 V
1.8 V to 3.6 V
XTS = 1, LFXT1Sx = 2, XCAPx = 0
2.2 V to 3.6 V
3 V to 3.6 V
1.8 V to 3.6 V
XTS = 1, LFXT1Sx = 3, XCAPx = 0
XTS = 1, XCAPx = 0, LFXT1Sx = 0,
f
LFXT1,HF
= 1 MHz,
C
L,eff
= 15 pF
OA
HF
Oscillation Allowance for HF
crystals
(refer to Figure 23 and Figure 24)
XTS = 1, XCAPx = 0, LFXT1Sx = 1
f
LFXT1,HF
= 4 MHz,
C
L,eff
= 15 pF
XTS = 1, XCAPx = 0, LFXT1Sx = 2
f
LFXT1,HF
= 16 MHz,
C
L,eff
= 15 pF
C
L,eff
Integrated effective load
capacitance, HF mode
(see Note NO TAG)
XTS = 1, XCAPx = 0 (see Note 2)
XTS = 1, XCAPx = 0, Measured at
P1.4/SMCLK, f
LFXT1,HF
= 10 MHz
XTS = 1, XCAPx = 0, Measured at
P1.4/SMCLK, f
LFXT1,HF
= 16 MHz
XTS = 1, LFXT1Sx = 3, XCAPx = 0
(see Notes 3)
40
2.2
2 2 V/3 V
40
2.2 V/3 V
30
50
60
300
kHz
2.2 V to 3.6 V
3 V to 3.6 V
MIN
0.4
1
2
2
2
0.4
0.4
0.4
2700
TYP
MAX
1
4
10
12
16
10
12
16
MHz
MHz
UNIT
MHz
MHz
f
LFXT1,HF2
f
LFXT1,HF,logic
LFXT1 oscillator logic level square
ill t l i l
l
wave input frequency HF mode
frequency,
800
惟
300
1
50
60
pF
Duty cycle
HF mode
%
f
Fault,HF
Oscillator fault frequency, HF
mode (see Note 4)
NOTES: 1. Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Since the PCB adds additional capacitance it is recommended to verify the correct load by measuring the ACLK frequency. For a
correct setup the effective load capacitance should always match the specification of the used crystal.
2. Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
3. Measured with logic level input frequency but also applies to operation with crystals.
4. Frequencies below the MIN specification will set the fault flag, frequencies above the MAX specification will not set the fault flag.
Frequencies in between might set the flag.
5. To improve EMI on the LFXT1 oscillator the following guidelines should be observed.
-
Keep the trace between the device and the crystal as short as possible.
-
-
Design a good ground plane around the oscillator pins.
-
-
Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
-
-
Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
-
-
-
-
-
-
-
Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.
If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other
documentation. This signal is no longer required for the serial programming adapter.
POST OFFICE BOX 655303
鈥?/div>
DALLAS, TEXAS 75265
51

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