MSP430x22x2, MSP430x22x4
MIXED SIGNAL MICROCONTROLLER
SLAS504A 鈭?JULY 2006 鈭?REVISED DECEMBER 2006
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
crystal oscillator, LFXT1, low frequency modes (see Note 4)
PARAMETER
fLFXT1,LF
LFXT1 oscillator crystal
frequency, LF mode 0, 1
TEST CONDITIONS
XTS = 0, LFXT1Sx = 0 or 1
VCC
1.8 V 鈭?3.6 V
MIN
TYP
32,768
MAX
UNIT
Hz
LFXT1 oscillator logic level
fLFXT1,LF,logic square wave input frequency,
LF mode
XTS = 0, LFXT1Sx = 3
XTS = 0, LFXT1Sx = 0;
fLFXT1,LF = 32,768 kHz,
CL,eff = 6 pF
XTS = 0, LFXT1Sx = 0;
fLFXT1,LF = 32,768 kHz,
CL,eff = 12 pF
XTS = 0, XCAPx = 0
XTS = 0, XCAPx = 1
XTS = 0, XCAPx = 2
XTS = 0, XCAPx = 3
XTS = 0, Measured at
P1.4/ACLK, fLFXT1,LF = 32,768
Hz
XTS = 0, LFXT1Sx = 3
(see Notes 2)
1.8 V 鈭?3.6 V
10,000
32,768
50,000
Hz
500
kW
OALF
Oscillation Allowance for LF
crystals
200
1
5.5
8.5
11
2.2 V/3 V
30
50
70
kW
pF
pF
pF
pF
%
CL,eff
Integrated effective Load
Capacitance, LF mode
(see Note 1)
Duty Cycle
LF mode
Oscillator fault frequency, LF
mode (see Note 3)
fFault,LF
2.2 V/3 V
10
10,000
Hz
NOTES: 1. Includes parasitic bond and package capacitance (approximately 2pF per pin).
Since the PCB adds additional capacitance it is recommended to verify the correct load by measuring the ACLK frequency. For a
correct setup the effective load capacitance should always match the specification of the used crystal.
2. Measured with logic level input frequency but also applies to operation with crystals.
3. Frequencies below the MIN specification will set the fault flag, frequencies above the MAX specification will not set the fault flag.
Frequencies in between might set the flag.
4. To improve EMI on the LFXT1 oscillator the following guidelines should be observed.
鈭?/div>
Keep as short a trace as possible between the device and the crystal.
鈭?/div>
Design a good ground plane around the oscillator pins.
鈭?/div>
Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
鈭?/div>
Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
鈭?/div>
Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.
鈭?/div>
If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
鈭?/div>
Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other
documentation. This signal is no longer required for the serial programming adapter.
internal very low power, low frequency oscillator (VLO)
PARAMETER
fVLO
dfVLO/dT
dfVLO/dVCC
VLO frequency
VLO frequency
temperature drift
VLO frequency supply
voltage drift
(see Note 1)
(see Note 2)
TEST CONDITIONS
TA
-40鈭?5擄C
105擄C
I: -40鈭?5擄C
T: -40鈭?05擄C
25擄C
VCC
2.2 V/3 V
2.2 V/3 V
2.2 V/3 V
1.8V 鈭?3.6V
0.5
4
MIN
4
TYP
12
MAX
20
22
kHz
%/擄C
%/V
UNIT
NOTES: 1. Calculated using the box method:
I Version: (MAX(鈭?0...85_C) 鈭?MIN(鈭?0...85_C))/MIN(鈭?0...85_C)/(85_C 鈭?(鈭?0_C))
T Version: (MAX(鈭?0...105_C) 鈭?MIN(鈭?0...105_C))/MIN(鈭?0...105_C)/(105_C 鈭?(鈭?0_C))
2. Calculated using the box method: (MAX(1.8...3.6V) 鈭?MIN(1.8...3.6V))/MIN(1.8...3.6V)/(3.6V 鈭?1.8V)
38
POST OFFICE BOX 655303
鈥?/div>
DALLAS, TEXAS 75265
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MSP430F2232IRHAR PDF文件相關(guān)型號(hào)
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標(biāo)準(zhǔn)包裝 1
類別 集成電路 (IC)
家庭 嵌入式 - 微控制器,
系列 MSP430F2xx
核心處理器 RISC
芯體尺寸 16-位
速度 16MHz
連通性 I²C,IrDA,LIN,SCI,SPI,UART/USART
外圍設(shè)備 欠壓檢測/復(fù)位,POR,PWM,WDT
輸入/輸出數(shù) 32
程序存儲(chǔ)器容量 8KB(8K x 8 + 256B)
程序存儲(chǔ)器類型 閃存
EEPROM 大小 -
RAM 容量 512 x 8
電壓 - 電源 (Vcc/Vdd) 1.8 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器 A/D 12x10b
振蕩器型 內(nèi)部
工作溫度 -40°C ~ 85°C
封裝/外殼 40-VFQFN 裸露焊盤
包裝 Digi-Reel®
其它名稱 296-26205-6
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