MC10E163, MC100E163
Table 8. AC CHARACTERISTICS
V
CCx
= 5.0 V; V
EE
= 0.0 V or V
CCx
= 0.0 V; V
EE
=
鈭?.0
V (Note 9)
0擄C
Symbol
f
MAX
t
PLH
t
PHL
Characteristic
Maximum Toggle Frequency
Propagation Delay to Output
D
SEL0
SEL1
SEL2
t
SKEW
Within-Device Skew (Note 10)
An, Bn to Q
An, Am to QA
Bn, Bm to QB
t
JITTER
t
r
t
f
Random Clock Jitter (RMS)
Rise/Fall Time
(20 - 80%)
275
375
575
275
375
575
275
375
575
40
30
30
<1
40
30
30
<1
40
30
30
<1
ps
ps
500
500
525
450
700
765
735
625
900
1050
950
825
500
500
525
450
700
765
735
625
900
1050
950
825
500
500
525
450
700
765
735
625
900
1050
950
825
ps
Min
700
Typ
1100
Max
Min
700
25擄C
Typ
1100
Max
Min
700
85擄C
Typ
1100
Max
Unit
MHz
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
9. 10 Series: V
EE
can vary
鈭?.46
V / +0.06 V.
100 Series: V
EE
can vary
鈭?.46
V / +0.8 V.
10. Within-device skew is defined as identical transitions on similar paths through a device; n = 0-7, m n, m = 0-7.
http://onsemi.com
5