MC10E151, MC100E151
Table 8. AC CHARACTERISTICS
V
CCx
= 5.0 V; V
EE
= 0.0 V or V
CCx
= 0.0 V; V
EE
=
鈭?.0
V (Note 9)
0擄C
Symbol
f
MAX
t
PLH
t
PHL
t
s
t
h
t
RR
t
PW
t
SKEW
t
JITTER
t
r
, t
f
Characteristic
Maximum Toggle Frequency
Propagation Delay to Output CLK, MR
Setup TIme
Hold Time
Reset Recovery Time
Minimum Pulse Width
Within-Device Skew (Note 10)
Random Clock Jitter (RMS)
Rise/Fall Times
(20 - 80%)
300
CLK, MR
D
D
Min
900
575
0
350
750
400
65
<1
450
700
300
Typ
1100
650
鈭?75
175
550
900
Max
Min
900
575
0
350
750
400
65
<1
450
700
300
25擄C
Typ
1100
650
鈭?75
175
550
900
Max
Min
900
575
0
350
750
400
65
<1
450
700
85擄C
Typ
1100
650
鈭?75
175
550
ps
ps
ps
ps
900
Max
Unit
MHz
ps
ps
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
9. 10 Series: V
EE
can vary
鈭?.46
V / +0.06 V.
100 Series: V
EE
can vary
鈭?.46
V / +0.8 V.
10. Within-device skew is defined as identical transitions on similar paths through a device.
Q
Driver
Device
Q
Z
o
= 50
W
D
Receiver
Device
Z
o
= 50
W
50
W
50
W
D
V
TT
V
TT
= V
CC
鈭?/div>
2.0 V
Figure 3. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D
鈭?/div>
Termination of ECL Logic Devices.)
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