LX1974
TM
廬
Ambient Light Detector
P
RODUCTION
D
ATA
S
HEET
PACKAGE DIMENSIONS
WWW .
Microsemi
.C
OM
BC
2-Pin 1206 Standard Carrier
D
C
L
Sensor Active
Area: 0.2 x 0.2mm
2
P
C
0.03
C
L
C
R
1
2
Top
E
胃
0.19 - 0.25mm
Sensor Active Area
A
Side
B
1
Bottom
H
X
Pin 1 Indicator (top side) /
Alignment Indicator (Bottom side)
Dim
A
B
C
D
E
H
螛
P
R
X
M
ILLIMETERS
MIN
MAX
0.95
1.25
0.40
0.70
0.90
1.10
3.05
3.35
1.90
2.10
0.40
0.60
3擄 nom
1.45
1.75
0.25 nom
0.02
0.05
I
NCHES
MIN
MAX
0.037 0.049
0.016 0.028
0.035 0.043
0.120 0.132
0.075 0.083
0.016 0.024
3擄 nom
0.057 0.069
0.010 nom
0.001
0.002
Note:
Dimensions do not include protrusions; these shall not excee
0.155mm (.006鈥? on any side.
1.50mm
0.06in.
Recommended Soldering Pattern for reflow soldering of the
BC (1206) package.
1.50mm
2.0mm
0.06in.
1.50mm
0.06in.
0.08in.
Super Imposed
1206 Package
Basic specification is < 5 seconds @ 260擄C when applying
solder.
4.00
1.75
Lead In:
10 min empty
Loaded:
3000 pcs
Lead Out:
40 min empty
5.25
8.00
2.00
M
ECHANICALS
M
ECHANICALS
0.20
4.00
1.30
Note: LX1974 parts are loaded bottom side up
Copyright
漏
2005
Rev. 1.0, 2006-05-09
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
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