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LP3907

Connection Diagrams and Package Mark Information

30017803

24-Lead LLP Package (top view

Note:

The physical placement of the package marking will vary from part to part.

(*) UZXYTT format: 鈥楿鈥?鈥?wafer fab code; 鈥榋鈥?鈥?assembly code; 鈥橷Y鈥?2 digit date code; 鈥楾T鈥?鈥?die run code. See http://www.national.com/quality/

marking_conventions.html for more information on marking information.

(**) Package received will have XXXX replaced with the specific part version ordered.

25-Bump Thin Micro SMD Package, Large Bump National Package Number TLA25AAA

30017890

30017889

Top View

Bottom View

30017888

Package Mark - Top View

www.national.com

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