LM158, LM158A, LM258, LM258A
LM358, LM358A, LM358Y, LM2904, LM2904Q
DUAL OPERATIONAL AMPLIFIERS
SLOS068C 鈥?JUNE 1976 鈥?REVISED JULY 1998
LM358Y chip information
These chips, when properly assembled, display characteristics similar to the LM358. Thermal compression or
ultrasonic bonding can be used on the doped-aluminum bonding pads. Chips can be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(7)
(6)
(5)
VCC+
(8)
1IN+
1IN鈥?/div>
2OUT
(3)
(2)
(7)
+
鈥?/div>
+
鈥?/div>
(4)
VCC鈥?/div>
Chip Thickness: 15 Typical
Bonding Pads: 4
脳
4 Minimum
TJ(max) = 150擄C
Tolerances Are
鹵10%.
All Dimensions Are in Mils.
No Backside Metallization
Pin (4) is Internally Connected to Backside of Chip.
(1)
(2)
(3)
(1)
(5)
(6)
1OUT
2IN+
2IN鈥?/div>
57
(8)
(4)
47
POST OFFICE BOX 655303
鈥?/div>
DALLAS, TEXAS 75265
3
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LM258AP PDF文件相關(guān)型號
LM2904DR,LM2904PW,LM358PWLE
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