Bipolar Stepping Motor Control
Step Sequencing Tables
Full Step
V
IN
1
L
L
H
H
L
V
IN
2
L
H
H
L
L
V
E
1 and V
E
2
e
H
Half Step
V
E
1
H
H
L
H
H
H
L
H
H
H
e
High
Motor Control Block Diagram
Step
1
2
3
4
1
V
E
2
L
H
H
H
L
H
H
H
L
L
e
Low
V
IN
1
L
L
X
H
H
H
X
L
L
V
IN
2
X
L
L
L
X
H
H
H
X
Step
1
2
3
4
5
6
7
8
1
TL H 8706 鈥?7
X
e
Don鈥檛 care
Mounting Instructions
The junction to ambient thermal resistance of the LM18293
can be reduced by soldering the ground pins to a suitable
copper area of the printed circuit board or to an external
heatsink The graph below which shows the maximum pow-
er dissipated and junction to ambient thermal resistance as
a function of the side 鈥樷€榣鈥欌€?of two equal square copper areas
having a thickness of 35m illustrates this In addition it is
possible to use an external heatsink (see illustration below)
During soldering the pins temperature must not exceed
230 C and the soldering time must not be longer than 12
seconds The external heatsink or printed circuit copper
area must be connected to electrical ground
Staver External Heat-sink
Maximum power dissipated
and junction to ambient
thermal resistance vs size
TL H 8706 鈥?8
TL H 8706 鈥?9
TL H 8706 鈥?10
5