COPAL
ELECTRONICS
CAS
SLIDE SWITCHES (SMD)
SURFACE MOUNT
TYPE SWITCHES
s
SOLDERING CONDITIONS
q
Soldering iron
3 s maximum at 300 擄C
q
Vapor-phase soldering
215 擄C, less than 35 s
q
Infrared reflow soldering
The temperature profile shown at right is recommended for
reflow soldering. However, process carefully in case of
infrared heater, because the absoription rate of the
object may vary according to its color, material, etc. and
thus heating rate can be different. Please note that the
surface temperature of the product should not exceed
240 藲C. When the product temperature exceeds 250 擄C,
deformation may occur due to heat.
3~4 min
Tp
Temperature
Tm
tm
Time
s
PACKAGING SPECIFICATIONS
<Taping packaging specifications>
q
Taping version is packaged in 1000 pcs. per reel.
Orders will be accepted for units of 1000 pcs., i.e., 1000,
2000, 3000 pcs., etc.
q
Taping version is boxed with two reels (2000 pcs.).
Tp 240
擄C
(Peak temperature)
Tm 180
擄C
(Melting point temperature)
tm 10 s (Melting time)
Maximum number of consecutive missing pieces=2
Leader length and reel dimension are shown in the
diagrams below:
q
Embossed tape dimensions
q
Reel dimensions
16.4
+2
0
(Unit: mm)
Empty
Filled
Empty
蠁
13鹵0.2
End
Head
40 mm min.
20 pitches min.
Leader
Direction of feed
400 mm min.
蠁
21鹵0.8
22.4 max.
q
Reel & embossed tape materials
Embossed tape: Plastic
Reel: Paper
q
Embossed tape pull strength
10 N {1.02 kgf} minimum
q
Peeling strength of seal tape
0.1~0.7 N {10.2~71.4 gf}
{ } : Reference only
q
Test method for peeling strength of seal tape
Seal cover tape
165擄~180擄
Peel direction
(300 mm/min)
Direction of feed
Carrier tape
s
Specifications are subject to change without notice. Specifications in this catalog are for reference. The formal specification sheets will be submitted upon request.
蠁
250鹵2
蠁
80 min.
2鹵0.5
1
2
3
4
5
6
