ADCMP580/ADCMP581/ADCMP582
OUTLINE DIMENSIONS
3.00
BSC SQ
0.45
PIN 1
INDICATOR
TOP
VIEW
2.75
BSC SQ
0.50
BSC
12擄 MAX
0.90
0.85
0.80
SEATING
PLANE
0.30
0.23
0.18
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
0.20 REF
1.50 REF
0.50
0.40
0.30
0.60 MAX
PIN 1
INDICATOR
13
12
16
1
*1.65
1.50 SQ
1.35
EXPOSED
PAD
9
(BOTTOM VIEW)
4
8
5
0.25 MIN
*COMPLIANT
TO
JEDEC STANDARDS MO-220-VEED-2
EXCEPT FOR EXPOSED PAD DIMENSION.
Figure 30. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
(CP-16-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model
ADCMP580BCP-WP
ADCMP580BCP鈥揜2
ADCMP580BCP鈥揜L7
ADCMP581BCP-WP
ADCMP581BCP鈥揜2
ADCMP581BCP鈥揜L7
ADCMP582BCP-WP
ADCMP582BCP-R2
ADCMP582BCP-RL7
EVAL-ADCMP580BCP
EVAL-ADCMP581BCP
EVAL-ADCMP582BCP
Temperature Range
鈭?0擄C to +125擄C
鈭?0擄C to +125擄C
鈭?0擄C to +125擄C
鈭?0擄C to +125擄C
鈭?0擄C to +125擄C
鈭?0擄C to +125擄C
鈭?0擄C to +125擄C
鈭?0擄C to +125擄C
鈭?0擄C to +125擄C
Package Description
16-LEAD LFCSP-VQ
16-LEAD LFCSP-VQ
16-LEAD LFCSP-VQ
16-LEAD LFCSP-VQ
16-LEAD LFCSP-VQ
16-LEAD LFCSP-VQ
16-LEAD LFCSP-VQ
16-LEAD LFCSP-VQ
16-LEAD LFCSP-VQ
Evaluation Board
Evaluation Board
Evaluation Board
Package Option
CP-16-3
CP-16-3
CP-16-3
CP-16-3
CP-16-3
CP-16-3
CP-16-3
CP-16-3
CP-16-3
Branding
GO7
GO7
GO7
GO9
GO9
GO9
GOB
GOB
GOB
Rev. 0 | Page 14 of 16