AD5547/AD5557
OUTLINE DIMENSIONS
9.80
9.70
9.60
38
20
4.50
4.40
4.30
6.40 BSC
1
19
PIN 1
1.20
MAX
8擄
0擄
0.15
0.05
COPLANARITY
0.10
0.50
BSC
0.27
0.17
SEATING
PLANE
0.20
0.09
0.70
0.60
0.45
COMPLIANT TO JEDEC STANDARDS MO-153BD-1
Figure 27. 38-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-38)
Dimension s shown in millimeters
ORDERING GUIDE
Model
AD5547BRU
AD5547BRU-REEL7
AD5557CRU
AD5557CRU-REEL7
Resolution
(Bits)
16
16
14
14
DNL
(LSB)
鹵1
鹵1
鹵1
鹵1
INL
(LSB)
鹵2
鹵2
鹵1
鹵1
Temperature
Range
鈥?0擄C to +125擄C
鈥?0擄C to +125擄C
鈥?0擄C to +125擄C
鈥?0擄C to +125擄C
Ordering
Quantity
50
1,000
50
1,000
Package Description
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Package
Option
RU-38
RU-38
RU-38
RU-38
Rev. 0 | Page 19 of 20