PACKAGING INFORMATION
Plastic TSOP 54鈥揚in, 86-Pin
Package Code: T (Type II)
N
N/2+1
E1
E
Notes:
1. Controlling dimension: millimieters,
unless otherwise specified.
2. BSC = Basic lead spacing between
centers.
3. Dimensions D and E1 do not include
mold flash protrusions and
should be
measured from the bottom of the
package
.
4. Formed leads shall be planar with
respect to one another within 0.004
inches at the seating plane.
1
D
N/2
SEATING PLANE
ZD
A
e
b
L
A1
偽
C
Symbol
Ref. Std.
No. Leads (N)
A
A1
A2
b
C
D
E1
E
e
L
L1
ZD
偽
Plastic TSOP (T - Type II)
Millimeters
Inches
Min
Max
Min
Max
54
鈥?/div>
0.047
0.002 0.006
鈥?/div>
鈥?/div>
0.012 0.018
0.005 0.0083
0.867 0.8827
0.395 0.405
0.455 0.471
0.031 BSC
0.016 0.024
鈥?/div>
鈥?/div>
0擄
8擄
Plastic TSOP (T - Type II)
Millimeters
Inches
Symbol Min Max
Min
Max
Ref. Std.
No. Leads (N)
86
A
A1
A2
b
C
D
E1
E
e
L
L1
ZD
偽
鈥?/div>
1.20
0.05 0.15
0.95 1.05
0.17 0.27
0.12 0.21
22.02 22.42
10.03 10.29
11.56 11.96
0.50 BSC
0.40 0.60
0.80 REF
0.61 REF
0擄
8擄
鈥?/div>
0.047
0.002 0.006
0.037 0.041
0.007 0.011
0.005 0.008
0.867 0.8827
0.395 0.405
0.455 0.471
0.020 BSC
0.016 0.024
0.031 REF
0.024 BSC
0擄
8擄
鈥?/div>
1.20
0.05 0.15
鈥?/div>
鈥?/div>
0.30 0.45
0.12 0.21
22.02 22.42
10.03 10.29
11.56 11.96
0.80 BSC
0.40 0.60
鈥?/div>
鈥?/div>
0.71 REF
0擄
8擄
Integrated Silicon Solution, Inc.
Rev. D
03/13/07
1
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