碌
PD75206
5
15. RECOMMEDED SOLDERING CONDITIONS
This product should be soldered and mounted under the conditions recommended below.
For details of recommended soldering conditions for the surface mounting type, refer to the document
鈥淪emiconductor Device Mount Technology鈥?(IEI-1207).
For soldering methods and conditions other than those recommended below, contact our salesman.
Table 15-1 Surface Mounting Type Conditions
碌
PD75206GF-脳脳脳-3BE : 64-pin plastic QFP (body 14
脳
20 mm)
Solderring Method
Wave soldering
Solderring Conditions
Solder bath temperature: 260
擄C
or less, Duration: 10 sec. max.,
Number of times: Once
Preheating temperature : 120
擄C
max. (package surface temperature)
Infrared reflow
VPS
Package peak temperature: 230
擄C,
Duration: 30 sec. max. (at 210
擄C
or above),
Number of times: Once
Package peak temperature: 215
擄C,
Duration: 40 sec. max. (at 200
擄C
or above),
Number of times: Once
Pin part temperature: 300
擄C
or below , Duration: 3 sec. max. (per device side)
IR-30-00-1
VP15-00-1
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Recommended
Condition Symbol
WS60-00-1
Pin part heating
*
For the storage period after dry-pack decompression storage conditions are max. 25
擄C,
65 % RH.
Note Use of more than one soldering method should be avoided (except in the case of pin part heating).
Table 15-2 Insertion Type Soldering Conditions
碌
PD75206CW-脳脳脳 : 64-pin plastic shrink DIP (750 mil)
Solderring Method
Wave soldering
(lead part only)
Pin part heating
Solderring Conditions
Solder bath temperature: 260
擄C
or below , Duration: 10 sec. max.
Pin part temperature: 260
擄C
or below , Duration: 10 sec. max.
Note
Ensure that the application of wave soldering is limited to the lead part and no solder touches the main
unit directly.
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