鈩?/div>
(I
D
= 2A)
R
I=2
鈩?
t
d=400ms; IN = low or high
Operating Temperature Range
Storage Temperature Range
Output Current per Channel (see el. characteristics)
Output Current per Channel @
T
A
= 25擄C
(All 4 Channels ON; Mounted on PCB )
3
)
Output Clamping Energy
I
D
= 1A
Power Dissipation (DC, mounted on PCB) @
T
A
= 25擄C
Electrostatic Discharge
Voltage (human body model)
according to MIL STD 883D, method 3015.7 and EOS/ESD
assn. standard S5.1 - 1993
DIN Humidity Category, DIN 40 040
IEC Climatic Category, DIN IEC 68-1
Thermal resistance
junction 鈥?case (die soldered on the frame)
junction - ambient @ min. footprint
junction - ambient @ 6 cm
2
cooling area
R
thJC
R
thJA
Symbol
V
S
V
DS
V
IN
V
Load Dump
2
)
62
52
T
j
T
stg
I
D(lim)
I
D
E
AS
P
tot
V
ESD
- 40 ... + 150
- 55 ... + 150
I
D(lim) min
1
50
3
2000
擄C
A
A
mJ
W
V
Values
-0.3 ... +7
45
- 0.3 ... + 7
Unit
V
V
V
V
E
40/150/56
K/W
2
50
38
Minimum footprint
PCB with heat pipes,
2
backside 6 cm cooling area
1
)
2
)
R
I
=internal resistance of the load dump test pulse generator LD200
V
LoadDump
is setup without DUT connected to the generator per ISO 7637-1 and DIN 40 839.
3
)
Output current rating so long as maximum junction temperature is not exceeded. At
T
A
= 125 擄C the output cur-
rent has to be calculated using
R
thJA
according mounting conditions.
V1.1
Page
3
26.Aug. 2002